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US 11,899,364 B2Granted
Photosensitive polyimide compositions
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsBinod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
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Abstract
This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
Claims22
A dry film structure, comprising:
- a carrier substrate;
- a first polymeric layer supported by the carrier substrate, wherein the first polymeric layer is a photosensitive polymeric layer, and the photosensitive polymeric layer comprises at least one fully imidized polyimide polymer;
- and
- a second polymeric layer, wherein the second polymeric layer is between the photosensitive polymeric layer and the carrier substrate and the second polymeric layer consists of at least one water soluble polymer;
- wherein the photosensitive polymeric layer has a film thickness of at most about 5 microns.
2 more elements
Dependencies are inferred from the claim text.