Peeling type developing apparatus
AssigneeNitto Electric Industrial Co., Ltd.
InventorsAkio Tsumura, Shun-ichi Hayashi, Chiharu Miyaake, Kazuo Oouchi, Yutaka Yamamura
Life of this patent
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Abstract
A peeling type developing method and apparatus for removing exposed photoresist from printed circuit boards. The printed circuit board is covered with a photopolymerization compound layer and then a transparent support layer. After exposure, a thin adhesive tape is stuck to the support layer extending obliquely across the board and crossing opposite corners thereof. The adhesive tape, together with the support layer and the unexposed portions of the photoresist material, are peeled off the printed circuit board by a pair of pinch rolls with the aid of a peeling bar in line contact with the substrate through the adhesive tape and the support layer.
Claims7
A peeling type developing device in which an image forming material layer comprising a transparent support and a photopolymerization compound layer formed thereon is formed on the surface of a rectangular substrate on which an image composed of exposed portions of said photopolymerization compound layer is to be formed, comprising:
- means for sticking an adhesive tape to said transparent support after said image forming material layer has been exposed in such a manner that said adhesive tape crosses opposite corners of said substrate;
- a pair of conveying pinch rolls for conveying said substrate obliquely;
- a peeling bar extending in a direction perpendicular to a direction of conveyance of said substrate;
- a pair of peeling pinch rolls for pulling said adhesive tape away from said substrate at a constant speed while moving said tape over said peeling bar with said peeling bar in line contact with said substrate through said adhesive tape and said picture forming material layer, whereby said adhesive tape, said support, and unexposed parts of said photopolymerization compound layer are peeled from said substrate, and exposed parts of said photopolymerization compound layer remain on said substrate.
A peeling type developing device in which an image forming material layer comprising a transparent support and a photopolymerization compound layer thereon is formed on a surface of a rectangular substrate on which an image composed of exposed portion of said photopolymerization layer is to be formed, comprising:
- means for sticking an adhesive tape to said transparent support after said image forming material layer has been exposed in such a manner that said adhesive tape crosses opposite corners of said substrate;
- a pair of conveying pinch rolls for conveying said substrate obliquely;
- a peeling bar extending in a direction perpendicular to a direction of conveyance of said substrate;
- a pair of peeling pinch rolls for pulling said adhesive tape away from said substrate at a constant speed while moving said tape over said peeling bar with said peeling bar in line contact with said substrate through said adhesive tape and said picture forming material layer, whereby said adhesive tape, said support, and unexposed parts of said photopolymerization compound layer are peeled from said substrate, and exposed parts of said photopolymerization compound layer remain on said substrate;
- peeling force control means comprising means for detecting a support peeling width equal to a length of a part of said transparent support in line contact with said peeling bar, and means for setting a tensile force of said pair of take-up pinch rolls exerted on said support according to said support peeling width.
Dependencies are inferred from the claim text.