Substrate treatment method, and computer storage medium
AssigneeTokyo Electron Limited
InventorsSeiji FUJIMOTO, Satoru SHIMURA
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Abstract
A substrate treatment method for performing a treatment for forming a pattern through precursor formation and a condensation reaction of a metal-containing resist, includes: suppressing the precursor formation of a film of the metal-containing resist formed on a substrate on which exposure and a PEB treatment have been performed; and subsequent thereto, improving selectivity of the film by the condensation reaction in the film before the forming the pattern.
Claims11
A substrate treatment method for performing a treatment for forming a pattern through precursor formation and a condensation reaction of a metal-containing resist, the substrate treatment method comprising:
- suppressing the precursor formation of a film of the metal-containing resist formed on a substrate on which exposure and a PEB treatment have been performed;
- and
- subsequent thereto, improving selectivity of the film by the condensation reaction in the film before the forming the pattern.
A substrate treatment method for performing a treatment for forming a pattern through precursor formation and a condensation reaction of a metal-containing resist, the substrate treatment method comprising:
- suppressing the precursor formation of the metal-containing resist by cooling a substrate on which a film of the metal-containing resist has been formed and exposure and a PEB treatment have been performed;
- and
- after the suppressing the precursor formation and before the forming the pattern, improving selectivity of the film during development by the condensation reaction in the film by applying energy to the film.
A computer-readable storage medium storing a program running on a computer of a controller for controlling a substrate treatment apparatus so as to cause the substrate treatment apparatus to execute a substrate treatment method for performing a treatment for forming a pattern through precursor formation and a condensation reaction of a metal-containing resist,
- the substrate treatment method comprising:
- suppressing the precursor formation of the metal-containing resist by cooling a substrate on which a film of the metal-containing resist has been formed and exposure and a PEB treatment have been performed;
- and
- after the suppressing the precursor formation and before the forming the pattern, improving selectivity of the film during development by the condensation reaction in the film by applying energy to the film.
Dependencies are inferred from the claim text.