G03F 7/3028
Characterised by means for on-wafer monitoring of the processing
Official title: {characterised by means for on-wafer monitoring of the processing}
G03F7/3028 (Characterised by means for on-wafer monitoring of the processing) appears on 73 US grants and 52 published applications in this corpus.
Search patents in G03F- Granted patents
- 73
- Published applications
- 52
- Assignees
- 39
- Inventors
- 141
- Latest grant
- 18 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 1 |
| 2003 | 4 | 4 |
| 2004 | 6 | 2 |
| 2005 | 4 | 5 |
| 2006 | 3 | 3 |
| 2007 | 3 | 2 |
| 2008 | 2 | 5 |
| 2009 | 1 | 3 |
| 2010 | 4 | 4 |
| 2011 | 4 | 3 |
| 2012 | 0 | 0 |
| 2013 | 3 | 2 |
| 2014 | 2 | 1 |
| 2015 | 1 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 3 | 1 |
| 2019 | 2 | 3 |
| 2020 | 1 | 4 |
| 2021 | 3 | 1 |
| 2022 | 0 | 2 |
| 2023 | 3 | 0 |
| 2024 | 1 | 1 |
| 2025 | 1 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Methods and systems for real-time quality control of a film in a spin coating process18 Mar 2025US 12,255,110 B2Samsung Electronics Co., Ltd.
- Substrate processing method, recording medium, and substrate processing apparatus10 Sep 2024US 12,083,553 B2Tokyo Electron Limited
- Solution, method of forming resist pattern, and semiconductor device manufacturing method21 Nov 2023US 11,822,250 B2Tokyo Ohka Kogyo.Co., Ltd.
- Enhanced microfabrication using electrochemical techniques10 Jan 2023US 11,549,903 B1National Technology & Engineering Solutions of Sandia, LLC
- Developer critical dimension control with pulse development3 Jan 2023US 11,543,793 B2International Business Machines Corporation
- Developer supply equipment23 Oct 2025US 2025/0328078 A1Samsung Electronics Co., Ltd.
- Method of manufacturing semiconductor device and semiconductor device manufacturing system28 Aug 2025US 2025/0271774 A1Nanya Technology Corporation
- Method for testing photosensitive composition and method for producing photosensitive composition11 Jul 2024US 2024/0231235 A1FUJIFILM Corporation
- Substrate processing method, recording medium, and substrate processing apparatus24 Nov 2022US 2022/0371048 A1Tokyo Electron Limited
- Methods and systems for real-time quality control of a film in a spin coating process27 Oct 2022US 2022/0344220 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Process for determining photoresist develop time by optical transmission80US 4,851,311 ATexas Instruments Incorporated · 1989
- Silicon wafer photoresist developer56US 4,922,277 AThe United States of America as represented by the Secretary of the Air Force · 1990
- Method of detecting an end point of surface treatment54US 4,998,021 ADainippon Screen Mfg.Co., Ltd. · 1991
- Method for monitoring photoresist latent images53US 5,124,216 AAT&T Bell Laboratories · 1992
- Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer53US 5,308,447 ALuxtron Corporation · 1994