G03F 7/092
Characterised by backside coating or layers, by lubricating-slip layers or means, by
Official title: {characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means}
G03F7/092 (Characterised by backside coating or layers, by lubricating-slip layers or means, by) appears on 258 US grants and 245 published applications in this corpus.
Search patents in G03F- Granted patents
- 258
- Published applications
- 245
- Assignees
- 125
- Inventors
- 658
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 10 | 0 |
| 2001 | 9 | 2 |
| 2002 | 6 | 12 |
| 2003 | 5 | 6 |
| 2004 | 5 | 5 |
| 2005 | 3 | 6 |
| 2006 | 4 | 16 |
| 2007 | 3 | 11 |
| 2008 | 3 | 13 |
| 2009 | 1 | 12 |
| 2010 | 11 | 7 |
| 2011 | 3 | 10 |
| 2012 | 8 | 17 |
| 2013 | 11 | 14 |
| 2014 | 12 | 14 |
| 2015 | 14 | 8 |
| 2016 | 4 | 11 |
| 2017 | 11 | 8 |
| 2018 | 2 | 6 |
| 2019 | 11 | 11 |
| 2020 | 7 | 9 |
| 2021 | 8 | 12 |
| 2022 | 3 | 13 |
| 2023 | 10 | 13 |
| 2024 | 5 | 2 |
| 2025 | 6 | 1 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polymer crosslink de-crosslink processes for resist patterning15 Sep 2026US 12,736,882 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Photochemical and thermal release layer processes and uses in device manufacturing7 Apr 2026US 12,596,306 B2Terecircuits Corporation
- Material for forming adhesive film, patterning process, and method for forming adhesive film8 Jul 2025US 12,351,742 B2Shin-Etsu Chemical Co., Ltd.
- Method of removing photoresist, laminate, method of forming metallic pattern, polyimide resin and stripper3 Jun 2025US 12,321,097 B2eChem Solutions Corp.
- Backside deposition tuning of stress to control wafer bow in semiconductor processing15 Apr 2025US 12,276,922 B2Tokyo Electron Limited
- Photosensitive resin composition, photosensitive resin film, photosensitive dry film, patterning process, and light emitting device25 Jun 2026US 2026/0177918 A1Shin-Etsu Chemical Co., Ltd.
- Flexographic printing plate precursor and manufacturing method of flexographic printing plate18 Jun 2026US 2026/0169381 A1FUJIFILM Corporation
- Photosensitive element and method for producing circuit board11 Jun 2026US 2026/0161073 A1
- Photosensitive element, and method for forming resist pattern11 Jun 2026US 2026/0161075 A1Asahi Kasei Kabushiki Kaisha
- Transfer film, pattern forming method, laminate, and semiconductor package28 May 2026US 2026/0147277 A1FUJIFILM Corporation
Most cited
By later US patents
- Assist layers for EUV lithography302US 8,968,989 B2Brewer Science Inc. · 2015
- PECVD films for EUV lithography291US 9,618,846 B2Lam Research Corporation · 2017
- Middle layer composition for trilayer patterning stack114US 9,146,469 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Oxygen barrier layers for photopolymerizable elements73US 4,072,527 AE. I. Du Pont de Nemours and Company · 1978
- Process for fabricating a device58US 5,750,312 ALucent Technologies Inc. · 1998