Transfer film, pattern forming method, laminate, and semiconductor package

Abstract

An object of the present invention is to provide a transfer film capable of forming a film which contributes to suppressing migration between wirings. The transfer film of the present invention includes, in the following order, a temporary support, a water-soluble resin layer, and a photosensitive composition layer, in which the photosensitive composition layer contains at least one specific compound selected from the group consisting of a polyimide precursor, a polyimide, a polybenzoxazole precursor, a polybenzoxazole, a phenol resin, an epoxy resin, a polyphenylene ether resin, a silicone resin, a benzocyclobutene resin, a fluorene resin, a liquid crystal polymer, a polyethersulfone, a polyarylate, a polyetherimide, a polybenzimidazole, a polyphenylsulfone, a polycarbonate, an acrylonitrile-butadiene-styrene copolymer resin, and a polyphenylene sulfide.

Dependencies are inferred from the claim text.