Photochemical and thermal release layer processes and uses in device manufacturing

A process for transferring a component, comprising:

• providing an assembly comprising a substrate, a release layer and a component, wherein the release layer is disposed over the substrate and the component is adhered to the release layer;
• heating the release layer from a heating source to at least a decomposition temperature, wherein the heating is selected from the group consisting of a conductive heating, a radiative heating and combinations thereof, and wherein the decomposition temperature is about 180° C. to about 220° C.;
• and
• exposing the release layer to an actinic wavelength of light from an actinic irradiation source, wherein the actinic wavelength of light is a wavelength of about 230 nm to about 360 nm;
• wherein the release layer comprises a photo enhanced decomposition compound selected from at least one of a polymer and an oligomer, wherein the photo enhanced decomposition compound comprises a linkage and a core unit comprising a tetralin core, a cyclohexene core, copolymers thereof, and combinations thereof, and wherein the photo enhanced decomposition compound is configured to decompose when heated and exposed to the actinic wavelength of light;
• wherein the heating and exposing steps degrade the release layer and transfer the component from the substrate to a target substrate;
• wherein the heating source and the actinic irradiation source are different sources;
• and
• wherein at least one of the heating and exposing steps are performed within a pulse period of about 10 ns to about 10 μs.

An assembly for transferring a component, comprising:

• a substrate;
• a plurality of heating sources disposed over the substrate;
• and
• a release layer disposed over the plurality of heating sources.

An assembly for transferring a component, comprising:

• a substrate;
• a light absorbing layer disposed over the substrate;
• a first cladding layer disposed over the light absorbing layer;
• and
• a release layer disposed over the first cladding layer.