G03F 7/0035
Multiple processes
Official title: {Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface}
G03F7/0035 (Multiple processes) appears on 1,020 US grants and 1,126 published applications in this corpus.
Search patents in G03F- Granted patents
- 1,020
- Published applications
- 1,126
- Assignees
- 441
- Inventors
- 2,563
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 8 | 0 |
| 1993 | 8 | 0 |
| 1994 | 13 | 0 |
| 1995 | 12 | 0 |
| 1996 | 8 | 0 |
| 1997 | 13 | 0 |
| 1998 | 25 | 0 |
| 1999 | 27 | 0 |
| 2000 | 22 | 0 |
| 2001 | 20 | 5 |
| 2002 | 17 | 20 |
| 2003 | 22 | 37 |
| 2004 | 15 | 49 |
| 2005 | 34 | 37 |
| 2006 | 22 | 31 |
| 2007 | 20 | 30 |
| 2008 | 24 | 39 |
| 2009 | 12 | 46 |
| 2010 | 32 | 86 |
| 2011 | 30 | 46 |
| 2012 | 53 | 44 |
| 2013 | 57 | 40 |
| 2014 | 55 | 73 |
| 2015 | 53 | 49 |
| 2016 | 44 | 52 |
| 2017 | 46 | 47 |
| 2018 | 35 | 40 |
| 2019 | 52 | 39 |
| 2020 | 27 | 50 |
| 2021 | 30 | 41 |
| 2022 | 34 | 41 |
| 2023 | 28 | 42 |
| 2024 | 27 | 54 |
| 2025 | 35 | 52 |
| 2026 | 20 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Technologies for aligned vias29 Sep 2026US 12,751,262 B2Intel Corporation
- Patterned aluminum nitride composite substrate and preparation method thereof25 Aug 2026US 12,716,146 B2Peking University
- Patterning method25 Aug 2026US 12,721,074 B2United Microelectronics Corp.
- Organometallic compound for mask, layer, method for processing organic semiconductor layer, and method for manufacturing organic semiconductor device18 Aug 2026US 12,709,625 B2Semiconductor Energy Laboratory Co.Ltd.
- Resist underlayer compositions and pattern formation methods using such compositions11 Aug 2026US 12,704,778 B2Dupont Electronic Materials International, LLC
- Method for Multicolor Lithography Using Mechanical Force8 Oct 2026US 2026/0308288 A1California Institute of Technology
- Scalable nanoimprint manufacturing of functional multi-layer metasurface devices24 Sep 2026US 2026/0287787 A1Arizona Board of Regents on behalf of Arizona State University
- Method of manufacturing a probe head manufactured by stacking probe pins and combined with a spatial converter and an anisotropic conductive film10 Sep 2026US 2026/0266876 A1NANO-X GmbH
- Method of manufacturing semiconductor device10 Sep 2026US 2026/0267221 A1Samsung Electronics Co., Ltd.
- Substrate processing method3 Sep 2026US 2026/0262456 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- Photoresist double patterning487US 8,282,847 B2Lam Research Corporation · 2012
- Atomic layer deposition lithography343US 8,932,802 B2APPLIED Materials.Inc. · 2015
- Method and apparatus for extending spatial frequencies in photolithography images288US 6,042,998 AUniversity of New Mexico · 2000
- Microfabricated devices and method of manufacturing the same268US 6,488,872 B1The Board of Trustees of the University of Illinois · 2002
- Self-aligned pattern over a reflective layer203US 5,935,763 AInternational Business Machines Corporation · 1999