G02B 6/4259
Of the transparent type
Official title: {of the transparent type}
G02B6/4259 (Of the transparent type) appears on 171 US grants and 166 published applications in this corpus.
Search patents in G02B- Granted patents
- 171
- Published applications
- 166
- Assignees
- 116
- Inventors
- 425
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 0 |
| 2002 | 9 | 10 |
| 2003 | 9 | 13 |
| 2004 | 5 | 8 |
| 2005 | 7 | 1 |
| 2006 | 2 | 0 |
| 2007 | 2 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 2 |
| 2010 | 1 | 4 |
| 2011 | 2 | 2 |
| 2012 | 3 | 3 |
| 2013 | 4 | 7 |
| 2014 | 5 | 8 |
| 2015 | 6 | 12 |
| 2016 | 8 | 4 |
| 2017 | 10 | 7 |
| 2018 | 5 | 16 |
| 2019 | 12 | 5 |
| 2020 | 9 | 5 |
| 2021 | 3 | 8 |
| 2022 | 7 | 3 |
| 2023 | 3 | 4 |
| 2024 | 2 | 11 |
| 2025 | 8 | 25 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical module29 Sep 2026US 12,748,272 B2Sumitomo Electric Industries, Ltd.
- Electro-optical interconnect platform4 Aug 2026US RE50,979 E1Teramount Ltd.
- Packaging optical components in a circuit package9 Jun 2026US 12,650,563 B2Celestial Al Inc.
- Package structure2 Jun 2026US 12,645,041 B2Unimicron Technology Corp.
- Converting processing dimensions of a wafer package10 Mar 2026US 12,571,971 B2Celestial AI Inc.
- Component with photonic integrated circuit3 Sep 2026US 2026/0259382 A1ams-OSRAM International GmbH
- Electronic device27 Aug 2026US 2026/0251868 A1Innolux Corporation
- Optical module and fabrication method for hybrid inp/si optical chip30 Jul 2026US 2026/0219462 A1Hisense Broadband Multimedia Technologies Co., Ltd.
- Interconnect module for high-speed data transmission30 Apr 2026US 2026/0121766 A1Samtec, Inc.
- Organic substrate for co-packaged optics2 Apr 2026US 2026/0093079 A1International Business Machines Corporation
Most cited
By later US patents
- Apparatus for launching or detecting waves of selected modes in an optical dielectric waveguide208US 4,125,768 AThe Post Office · 1978
- Small-scale optoelectronic package132US 6,910,812 B2Peregrine Semiconductor Corporation · 2005
- Tunable fiber Fabry-Perot surface-emitting lasers84US 6,263,002 B1Micron Optics, Inc. · 2001
- Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove70US 5,644,667 AFujitsu Limited · 1997
- Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove70US 5,764,832 AFujitsu Limited · 1998