Interconnect module for high-speed data transmission

An interconnect module comprising:

• a base substrate having a first surface and a second surface opposite the first surface, wherein at least a portion of the base substrate is transparent;
• a photonic integrated circuit mounted on the base substrate, wherein the photonic integrated circuit originates at least one transmit channel optical path;
• a photodetector array mounted on the base substrate, wherein the photodetector array terminates at least one receive channel optical path;
• and
• an isolator assembly that includes an optical isolator and an optical block, wherein the at least one transmit channel optical path passes through the optical isolator, thereby reducing or eliminating feedback to the photonic integrated circuit, and the at least one receive channel optical path passes through the optical block.