Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove

A method of manufacturing an integrated semiconductor optical device comprising the steps of:

• providing a support substrate having a main surface;
• forming a groove, which receives an optical fiber, on and extending from the main surface into the support substrate;
• after forming said groove, forming a flat surface layer on said main surface of said support substrate by applying a flat plate member, made of a material different from a material of said support substrate, on the main surface of said support substrate;
• after forming said flat surface layer, forming patterns of bonding pads on said flat surface layer;
• after forming said patterns, removing a portion of the flat surface layer disposed over and covering said groove, thereby exposing at least a portion of said groove corresponding to the removed portion of the flat surface layer and correspondingly defining a remaining portion of the flat surface layer, the patterns of bonding pads having been formed on the remaining portion of the flat surface layer;
• assembling and position an optical component on said remaining portion of said flat surface layer by bonding said optical component on said bonding pads;
• and
• assembling and positioning an optical fiber in said groove so that the optical axis of said optical fiber lies above said flat surface layer.

A method of manufacturing an integrated semiconductor optical device, comprising the steps of:

• providing a support substrate having a main surface;
• forming a groove, which receives an optical fiber, on and extending from the main surface into the support substrate;
• after forming said groove, forming a flat surface layer on said main surface of said support substrate by forming a polycrystalline semiconductor layer on the main surface of the support substrate including impregnating said groove with said polycrystalline semiconductor and lapping said polycrystalline semiconductor to form an exposed, flat surface thereof and thereby to define the flat surface layer;
• forming patterns of bonding pads on said flat surface layer;
• removing said polycrystalline semiconductor, both as impregnated in and as covering said V-groove, thereby exposing said V-groove;
• assembling and positioning said optical component onto said bonding pads on said flat surface;
• and
• after the step of V-groove exposure, assembling and positioning the optical fiber in said groove so that the optical axis of said optical fiber lies above said flat surface layer.