Organic substrate for co-packaged optics
AssigneeInternational Business Machines Corporation
InventorsSayuri Hada, Hiroyuki Mori, Akihiro Horibe
Life of this patent
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Abstract
Embodiments of the disclosed invention may include in one aspect, a semiconductor structure. The semiconductor structure may include a silicon chip, a polymer optical waveguide (POW) communicatively attached to a central portion of a bottom side of the silicon chip, and an organic substrate attached to a peripheral portion of the bottom side at least partially surrounding the central portion. The organic substrate may include a first via located at an inner via line and configured to convey a signal from the silicon chip to the organic substrate and a via stress support extending beyond the inner via line toward the central portion.
Claims20
A semiconductor structure, comprising:
- a silicon chip;
- a polymer optical waveguide (POW) communicatively attached to a central portion of a bottom side of the silicon chip;
- and
- an organic substrate attached to a peripheral portion of the bottom side at least partially surrounding the central portion, comprising:
- a first via located at an inner via line and configured to convey a signal from the silicon chip to the organic substrate;
- and
- a via stress support extending beyond the inner via line toward the central portion.
A semiconductor structure, comprising:
- a silicon chip;
- and
- an organic substrate attached to the bottom side of the silicon chip, comprising:
- a cutout providing an area for a polymer optical waveguide (POW) to be attached to the silicon chip;
- a first via located at an inner via line and configured to convey a signal from the silicon chip to the organic substrate;
- and
- a via stress support extending beyond the inner via line into the cutout.
A method of forming a semiconductor structure, comprising:
- fabricating an organic substrate;
- forming a cutout in the organic substrate, wherein the cutout comprises a via stress support extending beyond an inner via line designating a first via closest to the cutout;
- attaching a silicon chip to the organic substrate;
- and
- attaching a polymer optical waveguide (POW) to the silicon chip within the cutout.
Dependencies are inferred from the claim text.