G01R 31/303
Of integrated circuits
Official title: of integrated circuits (G01R31/305 - G01R31/315 take precedence)
G01R31/303 (Of integrated circuits) appears on 239 US grants and 144 published applications in this corpus.
Search patents in G01R- Granted patents
- 239
- Published applications
- 144
- Assignees
- 115
- Inventors
- 420
- Latest grant
- 18 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 2 |
| 2002 | 8 | 8 |
| 2003 | 7 | 4 |
| 2004 | 9 | 5 |
| 2005 | 5 | 10 |
| 2006 | 8 | 5 |
| 2007 | 5 | 6 |
| 2008 | 8 | 6 |
| 2009 | 5 | 7 |
| 2010 | 5 | 7 |
| 2011 | 8 | 4 |
| 2012 | 3 | 3 |
| 2013 | 4 | 3 |
| 2014 | 7 | 5 |
| 2015 | 3 | 3 |
| 2016 | 3 | 9 |
| 2017 | 24 | 8 |
| 2018 | 21 | 3 |
| 2019 | 23 | 10 |
| 2020 | 8 | 6 |
| 2021 | 14 | 7 |
| 2022 | 7 | 7 |
| 2023 | 3 | 7 |
| 2024 | 8 | 2 |
| 2025 | 4 | 2 |
| 2026 | 0 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and device for single event effect testing of large capacity solid state drives based on high-energy particles18 Nov 2025US 12,474,392 B1National Space Science Center, Chinese Academy of Sciences
- Semiconductor test device and system and test method using the same17 Jun 2025US 12,332,298 B2Samsung Electronics Co., Ltd.
- Benchmark device and method for evaluating a semiconductor wafer8 Apr 2025US 12,270,854 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Near field wireless communication system for mother to package and package to package sideband digital communication14 Jan 2025US 12,196,807 B2Intel Corporation
- Inspection method31 Dec 2024US 12,181,513 B2Hitachi High-Tech Corporation
- Neutron event rate detector8 Oct 2026US 2026/0309880 A1Raytheon Company
- Method and system of reconstructing electric current from magnetic field maps of 3d integrated circuits13 Aug 2026US 2026/0235665 A1Tata Consultancy Services Limited
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate13 Aug 2026US 2026/0235700 A1
- Semiconductor device, testing system, and method for testing device under test on semiconductor wafer9 Apr 2026US 2026/0101725 A1AP Memory Technology Corp.
- Chip for performing contactless chip test and method for performing contactless chip test on input/output driver8 Jan 2026US 2026/0009844 A1Mediatek Inc.
Most cited
By later US patents
- Inspection system, inspection method, and method for manufacturing semiconductor device145US 7,112,952 B2Semiconductor Energy Laboratory Co.Ltd. · 2006
- Inspection system, inspection method, and method for manufacturing semiconductor device138US 7,276,929 B2Semiconductor Energy Laboratory Co.Ltd. · 2007
- Method of probing a net of an IC at an optimal probe-point121US 5,530,372 ASchlumberger Technologies, Inc. · 1996
- Optimal probe point placement113US 5,675,499 ASchlumberger Technologies, Inc. · 1997
- Single point high resolution time resolved photoemission microscopy system and method113US 6,608,494 B1Advanced Micro Devices, Inc. · 2003