Benchmark device and method for evaluating a semiconductor wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLan-Chou Cho, Chewn-Pu Jou, Stefan Rusu
Life of this patent
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Abstract
A benchmark device and a method for evaluating a semiconductor wafer are provided. The benchmark device includes a first grating coupler, a second grating coupler and a waveguide. The waveguide has a least one bending section and is arranged in communication with the first grating coupler and the second grating coupler. The bending section comprises a first region having a first width and a first height, and a second region having a second width and a second height, wherein the first region is surrounded by the second region, and the second width decreases gradually from a first end of the bending section to a second end of the bending section.
Claims20
A benchmark device embedded within a semiconductor wafer, comprising:
- a first grating coupler;
- a second grating coupler;
- and
- a waveguide having a least one bending section, arranged in communication with the first grating coupler and the second grating coupler, wherein the bending section comprises:
- a first region having a first width and a first height;
- and
- a second region having a second width and a second height, wherein the first region is surrounded by the second region, and the second width decreases gradually from a first end of the bending section to a second end of the bending section.
A benchmark device, comprising:
- a first grating coupler;
- a second grating coupler;
- at least one waveguide, arranged in communication with the first grating coupler and the second grating coupler;
- a first splitter, coupling the at least one waveguide to divide or combine optical signals transmitted by the at least one waveguide;
- and
- a plurality of connectors, arranged between any two of the first splitter and a plurality of fifth splitters, wherein each one of the connectors is configured to connect an output of one of the first splitter and the fifth splitters with an input of another one of the first splitter and the fifth splitters.
A method for evaluating a semiconductor wafer, comprising:
- forming a waveguide having a bending section;
- providing a first region in the waveguide, wherein the first region has a first width and a first height;
- providing a second region compassing the first region, wherein the second region has a second width and a second height, wherein the second width decreases gradually from a first end of the bending section to a second end of the bending section;
- and
- providing a third region adjacent to the second region, wherein the third region has a third height and a third width, and the third width increases gradually from the first end of the bending section to the second end of the bending section.
Dependencies are inferred from the claim text.