Near field wireless communication system for mother to package and package to package sideband digital communication

A package substrate comprising:

• a circuit configured to perform engineering tests and end-user operations using sideband signals;
• a leaky surface wave launcher for near field wireless communication, the leaky surface wave launcher comprising:
• a via electrically coupled to the circuit, the via configured to provide the sideband signals to and receive the sideband signals from the circuit;
• and
• a strip line electrically coupled to the via, the strip line configured to be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device, wherein the strip line and the via are unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate;
• wherein the circuit comprises a transceiver electrically coupled between a portion of the circuit and the leaky surface wave launcher, the transceiver configured to process the sideband signals for use by the portion of the circuit and wireless transmission by the leaky surface wave launcher.