Semiconductor test device and system and test method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMeehyun Lim, Sungyeol Kim, Hyungjung Yong, Jinyeong Yun
Life of this patent
Estimating the term…
Abstract
A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
Claims20
A method for testing a semiconductor package including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip, the method comprising:
- controlling a test circuit included in the first semiconductor chip of the semiconductor package to cause emission of an electric field from at least a set of first upper pads among first upper pads of the second semiconductor chip;
- detecting an electric field emitted from the set of first upper pads using a sensor disposed above upper surfaces of the first upper pads and spaced apart therefrom by a predetermined interval;
- outputting a signal from the sensor, the signal including information about an electrical field waveform;
- and
- determining a contact failure between the first semiconductor chip and the second semiconductor chip in a signal processing device using the signal output from the sensor.
A method for testing a semiconductor package, the method comprising:
- determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of the semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip;
- and
- determining whether the semiconductor package is defective by using the test circuit after the assembly of the semiconductor package,
- wherein the test circuit is configured to cause emission of an electric field from at least some first upper pads among first upper pads of the second semiconductor chip,
- wherein the contact failure is determined by detecting the electric field by a sensor.
A method for testing a semiconductor package in a semiconductor test system, the method comprising:
- generating an electric field from the semiconductor package;
- and
- determining a contact failure of the semiconductor package by sensing the electric field,
- wherein the semiconductor test system comprises:
- at least one semiconductor package;
- a wiring circuit board including first upper pads and second upper pads;
- a circuit control device configured to control a test circuit embedded in a first semiconductor package among the at least one semiconductor package to emit the electric field from at least a set of the second upper pads of the wiring circuit board, for testing a semiconductor device in which the first semiconductor package is stacked on the first upper pads;
- a sensor configured to be disposed above upper surfaces of the second upper pads to be spaced apart therefrom by a predetermined interval, to detect an electric field emitted from the set of second upper pads and to output a signal including information on an electric field waveform;
- and
- a signal processing device configured to determine whether the semiconductor device is defective, using the signal output from the sensor.
Dependencies are inferred from the claim text.