G01N 2223/6116
Semiconductor wafer
Official title: semiconductor wafer
G01N2223/6116 (Semiconductor wafer) appears on 329 US grants and 453 published applications in this corpus.
Search patents in G01N- Granted patents
- 329
- Published applications
- 453
- Assignees
- 128
- Inventors
- 1,061
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 1 | 3 |
| 2008 | 2 | 6 |
| 2009 | 4 | 1 |
| 2010 | 2 | 2 |
| 2011 | 1 | 3 |
| 2012 | 1 | 4 |
| 2013 | 2 | 6 |
| 2014 | 6 | 11 |
| 2015 | 7 | 18 |
| 2016 | 8 | 12 |
| 2017 | 19 | 33 |
| 2018 | 22 | 19 |
| 2019 | 19 | 35 |
| 2020 | 34 | 27 |
| 2021 | 38 | 39 |
| 2022 | 33 | 46 |
| 2023 | 31 | 50 |
| 2024 | 30 | 51 |
| 2025 | 38 | 45 |
| 2026 | 28 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Overlay target measurement and shift compensation in charged particle systems and related methods6 Oct 2026US 12,754,150 B2Applied Materials Israel Ltd.
- Methods and systems for model-less, scatterometry based measurements of semiconductor structures22 Sep 2026US 12,743,027 B2KLA Corporation
- Inspection system15 Sep 2026US 12,736,487 B2Hitachi High-Tech Corporation
- Wafer measurement apparatus and operating method thereof15 Sep 2026US 12,736,488 B2Samsung Electronics Co., Ltd.
- Semiconductor profile measurement based on a scanning conditional model28 Jul 2026US 12,694,182 B2KLA Corporation
- Method for measuring defects in two-component compound wafer and apparatus thereof8 Oct 2026US 2026/0309655 A1SK Siltron Co., Ltd.
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid x-ray and optical metrology and navigation24 Sep 2026US 2026/0287527 A1Tokyo Electron Limited
- System and method for calibration of inspection tools17 Sep 2026US 2026/0276570 A1ASML Netherlands B. V.
- Measurement System, Computer, and Measurement Method10 Sep 2026US 2026/0268470 A1Hitachi High-Tech Corporation
Most cited
By later US patents
- Apparatus of plural charged particle beams with multi-axis magnetic lens39US 8,294,095 B2Hermes Microvision, Inc. · 2012
- Apparatus of plural charged-particle beams36US 10,062,541 B2Hermes Microvision, Inc. · 2018
- Method and apparatus for surface characterization and process control utilizing radiation from desorbed particles36US 4,393,311 ABell Telephone Laboratories, Incorporated · 1983
- Metrology tool with combined XRF and SAXS capabilities35US 9,778,213 B2KLA-Tencor Corporation · 2017
- X-ray thin film inspection device27US 10,473,598 B2Rigaku Corporation · 2019