C23C 18/1855
By mechanical pretreatment
Official title: {by mechanical pretreatment, e.g. grinding, sanding}
C23C18/1855 (By mechanical pretreatment) appears on 31 US grants and 28 published applications in this corpus.
Search patents in C23C- Granted patents
- 31
- Published applications
- 28
- Assignees
- 28
- Inventors
- 102
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 1 | 2 |
| 2005 | 3 | 3 |
| 2006 | 0 | 3 |
| 2007 | 1 | 1 |
| 2008 | 3 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 2 | 0 |
| 2015 | 1 | 4 |
| 2016 | 2 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Enhanced nickel plating process7 Dec 2021US 11,192,822 B2Western Digital Technologies, Inc.
- Plating method7 Jan 2020US 10,526,497 B2Mimaki Engineering Co., Ltd.
- Supported gas separation membrane and method19 Jul 2016US 9,394,611 B2Shell Oil Company
- Process for coating a surface of a substrate made of nonmetallic material with a metal layer2 Feb 2016US 9,249,512 B2Pegastech
- Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product6 Aug 2026US 2026/0225963 A1Denka Company Limited
- Method for producing a functional structure, and functional structure25 Jun 2026US 2026/0176786 A1Friedrich-Alexander-UniversitäT Erlangen-NüRnberg (Fau) PersonalköRperschaft Des öFfentlichen Rechts
- Apparatus and method for electroless surface finishing on glass13 Jun 2024US 2024/0194548 A1Intel Corporation
- Enhanced nickel plating process14 May 2020US 2020/0148589 A1Western Digital Technologies, Inc.
- Fuel tank for use with spacecraft and manufacturing method thereof17 Jan 2019US 2019/0016481 A1Kawasaki Jukogyo Kabushiki Kaisha
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Interconnect circuitry, multichip module, and methods of manufacturing thereof48US 6,838,750 B2Custom One Design, Inc. · 2005
- Metallized ceramic substrate and method therefor42US 5,058,799 A1991
- Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate41US 4,478,883 AInternational Business Machines Corporation · 1984
- Metallized ceramic substrate and method therefor35US 5,100,714 ACeramic Packaging, Inc. · 1992