C23C 18/1858
By formation of electrostatic charges
Official title: {by formation of electrostatic charges, e.g. tribofriction}
C23C18/1858 (By formation of electrostatic charges) appears on 5 US grants and 4 published applications in this corpus.
Search patents in C23C- Granted patents
- 5
- Published applications
- 4
- Assignees
- 4
- Inventors
- 15
- Latest grant
- 11 Nov 2008
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Interconnect circuitry, multichip module, and methods of manufacturing thereof11 Nov 2008US 7,449,412 B2Custom One Design, Inc.
- Interconnect circuitry, multichip module, and methods for making them20 Feb 2007US 7,179,742 B2Custom One Design, Inc.
- Interconnect circuitry, multichip module, and methods of manufacturing thereof4 Jan 2005US 6,838,750 B2Custom One Design, Inc.
- Process for producing thin transparent gold coatings2 Jan 2001US 6,168,825 A
- Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate23 Oct 1984US 4,478,883 AInternational Business Machines Corporation
- Interconnect circuitry, multichip module, and methods of manufacturing thereof5 Jul 2007US 2007/0155176 A1Custom One Design, Inc.
- Semiconductor component and method for the production thereof1 Jun 2006US 2006/0113531 A1Infineon Technologies AG
- Interconnect circuitry, multichip module, and methods for making them14 Jul 2005US 2005/0153061 A1Custom One Design, Inc.
- Interconnect circuitry, multichip module, and methods of manufacturing thereof16 Jan 2003US 2003/0011049 A1Custom One Design, Inc.
Most cited
By later US patents
- Interconnect circuitry, multichip module, and methods of manufacturing thereof48US 6,838,750 B2Custom One Design, Inc. · 2005
- Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate41US 4,478,883 AInternational Business Machines Corporation · 1984
- Interconnect circuitry, multichip module, and methods of manufacturing thereof13US 7,449,412 B2Custom One Design, Inc. · 2008
- Process for producing thin transparent gold coatings9US 6,168,825 A2001
- Interconnect circuitry, multichip module, and methods for making them2US 7,179,742 B2Custom One Design, Inc. · 2007