US 7,179,742 B2 · Interconnect circuitry, multichip module, and methods for making them

Abstract

Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. Electrical circuits and multichip modules including such circuits can be formed having one or more dielectric layers comprised of latex and one or more layers of conductive leads, one or more dielectric layers comprised of a flexible dielectric material, and one or more layers of electrically conductive material patterned to interconnect such ICs. Frames that hold ICs against a substrate may be employed to planarize their top surfaces against the substrate, as well as standard photolithographic techniques in creating conductive paths on the dielectric material between the ICs.

Claims22

Dependent claims

A method of manufacturing a multichip module, comprising the steps of:

placing a frame on a first flat substrate, said frame having holes in it for positioning and holding integrated circuit chips;
placing integrated circuit chips through frame to planarize their top, active, surfaces against the first flat substrate;
removing the first substrate from the frame and the chips;
placing one or more layers of dielectric on top of the frame and chips;
using photolithographic techniques to etch vias through each of the one or more dielectric layers to allow selective contact to conductive bonding pads on individual chips or conductive paths on the dielectric layer below;
using photolithographic techniques to lay down conductive material in such vias and in desired conductive pathways on the currently to layer of dielectric material.

3 more elements

Dependencies are inferred from the claim text.

Interconnect circuitry, multichip module, and methods for making them

Life of this patent

Interconnect circuitry, multichip module, and methods for making them

Life of this patent

Abstract

Claims22