Interconnect circuitry, multichip module, and methods of manufacturing thereof

A multichip module comprising:

• a plurality of integrated circuits mounted on a substrate;
• at least one flexible dielectric layer comprised of latex;
• and
• at least a corresponding number of layers of electrically conductive material patterned to form multiple electrical interconnects between bonding pads on different ones of said integrated circuits, at least one of the corresponding number of electrically conductive material layers disposed above a corresponding one of the at least one flexible dielectric layer;
• wherein one or more of said at least one flexible dielectric layer comprised of latex has a top surface that contains peaks and valleys of a size that would not occur on the top surface of the latex had it not been roughened, and one or more of said conductive layers is formed of a first conductive metal that substantially fills said valleys formed in the portion of the latex layer's top surface over which the conductive layer's metal has been patterned, so as to increase the ability of said metal to adhere to said latex surface.