Interconnect circuitry, multichip module, and methods of manufacturing thereof

A method of plating metallic material on the surface of a dielectric material, said method comprising the steps of:

• plasma etching the surface of the dielectric material to roughen its surface and to create peaks and valleys in the surface of that material which have van der Waal forces capable of attracting catalytic particles which have a slight electrostatic dipole;
• dipping the surface of the dielectric material in a solution containing catalytic metal particles which have a slight electrostatic dipole when in solution to help those particles attach to the dielectric material's surface;
• and
• placing the surface of the dielectric material in a metal salt solution in metastable equilibrium with a reducing agent so as to cause the metal to be plated upon the surface of the dielectric material containing the catalytic metal particles by a process of electroless plating;
• wherein the dielectric material is polyimide.

A method of plating metallic material on the surface of a dielectric material, said method comprising the steps of:

• plasma etching the surface of the dielectric material to roughen its surface and to create peaks and valleys in the surface of that material which have van der Waal forces capable of attracting catalytic particles which have a slight electrostatic dipole;
• dipping the surface of the dielectric material in a solution containing catalytic metal particles which have a slight electrostatic dipole when in solution to help those particles attach to the dielectric material's surface;
• and
• placing the surface of the dielectric material in a metal salt solution in metastable equilibrium with a reducing agent so as to cause the metal to be plated upon the surface of the dielectric material containing the catalytic metal particles by a process of electroless plating;
• wherein the metal deposited by the electroless plating is copper.

A method of plating metallic material on the surface of a dielectric material, said method comprising the steps of:

• plasma etching the surface of the dielectric material to roughen its surface and to create peaks and valleys in the surface of that material which have van der Waal forces capable of attracting catalytic particles which have a slight electrostatic dipole;
• dipping the surface of the dielectric material in a solution containing catalytic metal particles which have a slight electrostatic dipole when in solution to help those particles attach to the dielectric material's surface;
• and
• placing the surface of the dielectric material in a metal salt solution in metastable equilibrium with a reducing agent so as to cause the metal to be plated upon the surface of the dielectric material containing the catalytic metal particles by a process of electroless plating;
• wherein the solution containing the catalytic particles contains chemicals to reduce the tendency of the catalytic particles to conglomerate in solution.

A method of plating metallic material on the surface of a dielectric material, said method comprising the steps of:

• plasma etching the surface of the dielectric material to roughen its surface and to create peaks and valleys in the surface of that material which have van der Waal forces capable of attracting catalytic particles which have a slight electrostatic dipole;
• dipping the surface of the dielectric material in a solution containing catalytic metal particles which have a slight electrostatic dipole when in solution to help those particles attach to the dielectric material's surface;
• and
• placing the surface of the dielectric material in a metal salt solution in metastable equilibrium with a reducing agent so as to cause the metal to be plated upon the surface of the dielectric material containing the catalytic metal particles by a process of electroless plating;
• and
• using electroplating to put down an additional thickness of material on the layer of metal which has been deposited by electroless plating.