Plating method
AssigneeMimaki Engineering Co., Ltd.
InventorsMasaru Ohnishi, Toshiya Ito
Life of this patent
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Abstract
The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.
Claims11
A plating method comprising:
- a bulge forming process of forming a bulge on an object to be plated by ejecting first ink drops of first UV-curable ink from a first inkjet head such that the ejected first ink drops land on the object;
- and
- a plating process of plating the object having the bulge formed thereon, after the bulge forming process;
- wherein, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated, and the first surface of the object to be plated has a different glossiness than the second surface of the bulge to be plated.
A plating method comprising:
- a bulge forming process of forming a bulge on an object to be plated by ejecting first ink drops of first UV-curable ink from a first inkjet head such that the ejected first ink drops land on the object;
- a mask forming process of forming a plating mask on the object by ejecting second ink drops of second UV-curable ink from a second inkjet head such that the ejected second ink drops land on the object;
- a plating process of plating the object having the bulge formed thereon, after the bulge forming process;
- and
- a mask removing process of removing the plating mask from the object, after the plating process, wherein the plating mask is formed to be spaced apart from the neighboring bulge by a predetermined distance,
- and in the mask removing process, the plating mask is removed using an organic solvent for mask removal, in which the first UV-curable ink is insoluble in the organic solvent and the second UV-curable ink is soluble in the organic solvent.
A plating method comprising:
- a bulge forming process of forming a bulge on an object to be plated by ejecting first ink drops of first UV-curable ink from a first inkjet head such that the ejected first ink drops land on the object;
- and
- a plating process of plating the object having the bulge formed thereon, after the bulge forming process;
- wherein the bulge forming process includes:
- a semi-hardened-layer forming process of semi-hardening the first ink drops landed on the object by irradiation with ultraviolet light, thereby forming a semi-hardened layer;
- and
- a completely-hardened-layer forming process of further ejecting the first ink drops to land on the semi-hardened layer, and completely hardening the semi-hardened layer and the first ink drops landed on the semi-hardened layer at the same time by irradiation with ultraviolet light having intensity higher than that in the semi-hardened-layer forming process, thereby forming a completely hardened layer;
- wherein, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated, and the first surface of the object to be plated has a different glossiness than the second surface of the bulge to be plated.
Dependencies are inferred from the claim text.