C23C 18/1834
Use of organic or inorganic compounds other than metals
Official title: {Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers}
C23C18/1834 (Use of organic or inorganic compounds other than metals) appears on 68 US grants and 104 published applications in this corpus.
Search patents in C23C- Granted patents
- 68
- Published applications
- 104
- Assignees
- 68
- Inventors
- 234
- Latest grant
- 10 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 2 |
| 2003 | 1 | 3 |
| 2004 | 3 | 4 |
| 2005 | 2 | 4 |
| 2006 | 1 | 5 |
| 2007 | 3 | 5 |
| 2008 | 1 | 4 |
| 2009 | 0 | 10 |
| 2010 | 3 | 0 |
| 2011 | 2 | 2 |
| 2012 | 2 | 2 |
| 2013 | 4 | 2 |
| 2014 | 2 | 11 |
| 2015 | 4 | 3 |
| 2016 | 4 | 9 |
| 2017 | 6 | 9 |
| 2018 | 5 | 6 |
| 2019 | 4 | 7 |
| 2020 | 0 | 4 |
| 2021 | 6 | 5 |
| 2022 | 2 | 1 |
| 2023 | 1 | 0 |
| 2024 | 2 | 2 |
| 2025 | 1 | 4 |
By publication year. Applications have been published since 2001.
Recent patents
- Capacitor manufacturing process capable of controlling capacitor resistance and without welding tin-copper conductive sheet10 Jun 2025US 12,327,687 B1Suzhou Josun Precision Stamping Co., Ltd.
- Zincating and doping of metal liner for liner passivation and adhesion improvement14 May 2024US 11,984,354 B2Lam Research Corporation
- Metal-CNT composite, production method and materials therefor16 Jan 2024US 11,873,570 B2Luxembourg Institute of Science and Technology (List)
- Substrate liquid processing apparatus, substrate liquid processing method and recording medium24 Oct 2023US 11,795,546 B2Tokyo Electron Limited
- Cleaning solution for cleaning metal surfaces18 Oct 2022US 11,473,036 B2Atotech Deutschland GmbH
- A method for coating a component of an electrolyser27 Nov 2025US 2025/0361621 A1Oort Energy Ltd.
- Electroless plating method28 Aug 2025US 2025/0270703 A1TXC Corporation
- Methods for infiltrating gallium into porous scaffolds14 Aug 2025US 2025/0257468 A1U.S. Army DEVCOM Army Research Laboratory
- Capacitor manufacturing process capable of controlling capacitor resistance and without welding tin-copper conductive sheet12 Jun 2025US 2025/0191842 A1Suzhou Josun Precision Stamping Co., Ltd.
- Selective polymer metalization for composite materials20 Jun 2024US 2024/0200194 A1
Most cited
By later US patents
- Pretreating solution for electroless plating, electroless plating bath and electroless plating process31US 6,174,353 B1Ibiden Co., Ltd. · 2001
- Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application30US 6,821,909 B2APPLIED Materials.Inc. · 2004
- Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation29US 6,794,288 B1Blue29, LLC · 2004
- Method of chrome plating magnesium and magnesium alloys24US 8,152,985 B2Arlington Plating Company · 2012
- Method for depositing a metal on a surface22US 4,511,597 AKollmorgen Technologies Corporation · 1985