Capacitor manufacturing process capable of controlling capacitor resistance and without welding tin-copper conductive sheet

A capacitor manufacturing process capable of controlling capacitor resistance and without welding a tin-copper conductive sheet, comprising the following working steps:

• (1) electroplating, involving:
• electroplating a capacitor base layer, for being compatible with different metal materials;
• (2) vacuum plating, involving:
• vacuum plating a metal layer, for being compatible with different metal materials and non-metal materials;
• and
• (3) electroplating, involving:
• electroplating a metal outer layer, for reducing a capacitor resistance value and further controlling the capacitor resistance to be less than 3 milliohms;
• wherein
• the step (1) electroplating a capacitor base layer comprises the following working steps:
• 1) washing and degreasing, involving:
• removing oil stains generated during a manufacturing procedure on a surface of a product by using ultrasonic waves and a degreasing agent;
• 2) washing, involving:
• washing with pure water at room temperature, for removing a residual degreasing agent on the surface of the product;
• 3) zinc deposition, involving:
• soaking in a zinc solution for zinc deposition to facilitate subsequent electroplating;
• 4) washing and activation, involving:
• activating the product by using a sulfuric acid pure water solution containing 5%-10% of sulfuric acid, allowing a metal surface layer of the product to maintain an active state for electroplating, wherein the washing refers to performing washing in pure water at room temperature, and the washing refers to flipping the product in the pure water to clean the surface of the product;
• 5) electroless nickel plating, wherein an electroless nickel solution for the electroless nickel plating comprises 25 g/L-28 g/L nickel sulfate, 23 g/L-28 g/L sodium hypophosphite, and a remaining amount of ionized water;
• 6) washing and activation, involving:
• activating the product by using a sulfuric acid pure water solution containing 5%-10% of sulfuric acid, allowing a metal surface layer of the product to maintain an active state for electroplating, wherein the washing refers to performing washing in pure water at room temperature, and the washing refers to flipping the product in the pure water to clean the surface of the product;
• and
• 7) gold plating, involving:
• performing electroplating in a gold solution at 35-75° C. for 5-10 min or using chemical plating;
• the step (2) vacuum plating a metal layer comprises the following working steps:
• 8) washing and drying, involving:
• washing a residual electroplating solution on the surface of the product with pure water, wherein the washing refers to flipping the product in the pure water to clean the surface of the product;
• and drying the product with hot air to remove residual moisture on the surface of the product;
• 9) vacuum electroplating a metal layer, wherein production starts in a state when a furnace temperature of a vacuum furnace is 150-280° C. and a vacuum degree is controlled to be 3.0×10−3 Pa, and an operating time is 30-60 min;
• 10) cooling and discharging, involving:
• after the furnace temperature drops to below 100° C., releasing air to make vacuum pressure return to a normal atmospheric pressure state to open the furnace;
• and
• 11) inspection, involving:
• checking whether different metal materials and non-metal materials in the product are compatible by using inspection equipment;
• wherein the step (3) electroplating a metal outer layer comprises the following steps:
• 12) washing and activation, involving:
• activating the product by using a sulfuric acid pure water solution containing 5%-10% of sulfuric acid, allowing a metal surface layer of the product to maintain an active state for electroplating, wherein the washing refers to performing washing in pure water at room temperature and to flipping the product in the pure water to clean the surface of the product;
• 13) copper plating, involving:
• electroplating the product in a copper solution at 35-75° C. for 40-90 min or using chemical plating;
• 14) washing and activation, involving:
• activating the product by using a sulfuric acid pure water solution containing 5%-10% of sulfuric acid, allowing a metal surface layer of the product to maintain an active state for electroplating, wherein the washing refers to performing washing in pure water at room temperature and to flipping the product in the pure water to clean the surface of the product;
• 15) Ni plating, involving:
• performing electroplating in a nickel solution at 35-75° C. for 15-30 min;
• 16) washing and activation, involving:
• activating the product by using a sulfuric acid pure water solution containing 5%-10% of sulfuric acid, allowing a metal surface layer of the product to maintain an active state for electroplating, wherein the washing refers to performing washing in pure water at room temperature and to flipping the product in the pure water to clean the surface of the product;
• 17) Ag plating or Au plating, wherein the Ag plating refers to performing electroplating in a silver solution at 35-75° C. for 5-10 min or using chemical plating;
• and the Au plating refers to performing electroplating in a gold solution at 30-60° C. for 5-10 min or using chemical plating;
• 18) washing and drying, involving:
• washing a residual electroplating solution on the surface of the product with pure water, wherein the washing refers to flipping the product in the pure water to clean the surface of the product;
• and drying the product with hot air to remove residual moisture on the surface of the product;
• and
• 19) inspection, involving:
• inspecting whether resistance of the product is less than 3 milliohms by using inspection equipment.