C23C 18/1827
Only one step pretreatment
Official title: {only one step pretreatment}
C23C18/1827 (Only one step pretreatment) appears on 161 US grants and 231 published applications in this corpus.
Search patents in C23C- Granted patents
- 161
- Published applications
- 231
- Assignees
- 132
- Inventors
- 534
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 5 | 6 |
| 2003 | 4 | 7 |
| 2004 | 4 | 9 |
| 2005 | 3 | 11 |
| 2006 | 1 | 10 |
| 2007 | 3 | 10 |
| 2008 | 2 | 7 |
| 2009 | 0 | 12 |
| 2010 | 6 | 0 |
| 2011 | 2 | 5 |
| 2012 | 4 | 4 |
| 2013 | 4 | 9 |
| 2014 | 5 | 14 |
| 2015 | 6 | 11 |
| 2016 | 11 | 28 |
| 2017 | 10 | 13 |
| 2018 | 10 | 14 |
| 2019 | 8 | 14 |
| 2020 | 7 | 10 |
| 2021 | 13 | 13 |
| 2022 | 5 | 4 |
| 2023 | 5 | 7 |
| 2024 | 3 | 4 |
| 2025 | 5 | 8 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for blackening an electrical conduit28 Apr 2026US 12,615,011 B2Merlin Solar Technologies, Inc.
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Etchant and method of surface treatment of aluminum or aluminum alloy28 Oct 2025US 12,454,760 B2C. Uyemura & Co., Ltd.
- Metal material and method for manufacturing metal material30 Sep 2025US 12,428,732 B2Sumitomo Electric Industries, Ltd.
- Multilayer corrosion system9 Sep 2025US 12,410,525 B2MacDermid, Incorporated
- A method for coating a component of an electrolyser27 Nov 2025US 2025/0361621 A1Oort Energy Ltd.
- Conformal copper deposition on thin liner layer30 Oct 2025US 2025/0333845 A1Lam Research Corporation
- Composition for depositing a palladium coating on a substrate30 Oct 2025US 2025/0333847 A1Atotech Deutschland GmbH
- Electroless plating method28 Aug 2025US 2025/0270703 A1TXC Corporation
- Conductive film and display device28 Aug 2025US 2025/0271710 A1TDK Corporation
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process241US 6,616,967 B1Texas Instruments Incorporated · 2003
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987