C23C 18/1831
Use of metal
Official title: {Use of metal, e.g. activation, sensitisation with noble metals}
C23C18/1831 (Use of metal) appears on 101 US grants and 134 published applications in this corpus.
Search patents in C23C- Granted patents
- 101
- Published applications
- 134
- Assignees
- 77
- Inventors
- 299
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 5 | 4 |
| 2003 | 3 | 5 |
| 2004 | 2 | 6 |
| 2005 | 2 | 9 |
| 2006 | 0 | 5 |
| 2007 | 1 | 8 |
| 2008 | 2 | 2 |
| 2009 | 0 | 4 |
| 2010 | 4 | 0 |
| 2011 | 0 | 3 |
| 2012 | 2 | 2 |
| 2013 | 1 | 5 |
| 2014 | 5 | 10 |
| 2015 | 4 | 8 |
| 2016 | 7 | 19 |
| 2017 | 7 | 7 |
| 2018 | 6 | 9 |
| 2019 | 5 | 6 |
| 2020 | 5 | 4 |
| 2021 | 6 | 5 |
| 2022 | 3 | 2 |
| 2023 | 1 | 5 |
| 2024 | 2 | 2 |
| 2025 | 1 | 3 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for blackening an electrical conduit28 Apr 2026US 12,615,011 B2Merlin Solar Technologies, Inc.
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Etchant and method of surface treatment of aluminum or aluminum alloy28 Oct 2025US 12,454,760 B2C. Uyemura & Co., Ltd.
- Metal-CNT composite, production method and materials therefor16 Jan 2024US 11,873,570 B2Luxembourg Institute of Science and Technology (List)
- Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate9 Jan 2024US 11,865,518 B2National Tsing Hua University
- Composition for depositing a palladium coating on a substrate30 Oct 2025US 2025/0333847 A1Atotech Deutschland GmbH
- Conductive film and display device28 Aug 2025US 2025/0271710 A1TDK Corporation
- Silver free surface coating24 Jul 2025US 2025/0235587 A1Bactiguard AB
- Catalyst ink for plating and electroless plating method using same31 Oct 2024US 2024/0360331 A1Korea Electrotechnology Research Institute
- Plating Solutions for Composite PTFE Plating11 Jul 2024US 2024/0228816 A1Surface Technology, Inc.
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process241US 6,616,967 B1Texas Instruments Incorporated · 2003
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987