C23C 18/1824
By chemical pretreatment
Official title: {by chemical pretreatment}
C23C18/1824 (By chemical pretreatment) appears on 350 US grants and 512 published applications in this corpus.
Search patents in C23C- Granted patents
- 350
- Published applications
- 512
- Assignees
- 284
- Inventors
- 1,200
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 4 |
| 2002 | 6 | 9 |
| 2003 | 9 | 13 |
| 2004 | 8 | 21 |
| 2005 | 6 | 23 |
| 2006 | 7 | 25 |
| 2007 | 13 | 25 |
| 2008 | 3 | 19 |
| 2009 | 2 | 27 |
| 2010 | 10 | 18 |
| 2011 | 4 | 14 |
| 2012 | 10 | 12 |
| 2013 | 10 | 22 |
| 2014 | 11 | 23 |
| 2015 | 15 | 31 |
| 2016 | 22 | 43 |
| 2017 | 20 | 33 |
| 2018 | 24 | 24 |
| 2019 | 17 | 19 |
| 2020 | 16 | 32 |
| 2021 | 20 | 18 |
| 2022 | 11 | 19 |
| 2023 | 11 | 13 |
| 2024 | 7 | 12 |
| 2025 | 8 | 12 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for performing localized electroless nickel plating6 Oct 2026US 12,753,513 B2Nuovo Pignone Tecnologie Srl
- Method for blackening an electrical conduit28 Apr 2026US 12,615,011 B2Merlin Solar Technologies, Inc.
- Low friction coating for melt blown die and preparation method for coating31 Mar 2026US 12,590,037 B2Taizhou Clean Carbon Technology Co., Ltd.
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Etchant and method of surface treatment of aluminum or aluminum alloy28 Oct 2025US 12,454,760 B2C. Uyemura & Co., Ltd.
- Aluminum matrix composite material and preparation method therefor, and electronic device2 Jul 2026US 2026/0185258 A1Huawei Technologies Co., Ltd.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
- A method for coating a component of an electrolyser27 Nov 2025US 2025/0361621 A1Oort Energy Ltd.
- Conformal copper deposition on thin liner layer30 Oct 2025US 2025/0333845 A1Lam Research Corporation
- Composition for depositing a palladium coating on a substrate30 Oct 2025US 2025/0333847 A1Atotech Deutschland GmbH
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Method for forming Co-W-P-Au films259US 6,323,128 B1International Business Machines Corporation · 2001
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Method for electroless nickel plating of metal substrates251US 5,843,538 A1998