C23C 18/1837
Multistep pretreatment
Official title: {Multistep pretreatment}
C23C18/1837 (Multistep pretreatment) appears on 197 US grants and 303 published applications in this corpus.
Search patents in C23C- Granted patents
- 197
- Published applications
- 303
- Assignees
- 191
- Inventors
- 775
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 3 |
| 2002 | 2 | 3 |
| 2003 | 5 | 7 |
| 2004 | 4 | 12 |
| 2005 | 3 | 13 |
| 2006 | 6 | 15 |
| 2007 | 10 | 14 |
| 2008 | 2 | 14 |
| 2009 | 1 | 16 |
| 2010 | 4 | 18 |
| 2011 | 1 | 8 |
| 2012 | 7 | 9 |
| 2013 | 8 | 13 |
| 2014 | 5 | 11 |
| 2015 | 11 | 21 |
| 2016 | 13 | 17 |
| 2017 | 10 | 24 |
| 2018 | 14 | 9 |
| 2019 | 9 | 10 |
| 2020 | 11 | 23 |
| 2021 | 8 | 8 |
| 2022 | 7 | 13 |
| 2023 | 5 | 9 |
| 2024 | 3 | 8 |
| 2025 | 4 | 4 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Low friction coating for melt blown die and preparation method for coating31 Mar 2026US 12,590,037 B2Taizhou Clean Carbon Technology Co., Ltd.
- Multilayer corrosion system9 Sep 2025US 12,410,525 B2MacDermid, Incorporated
- Preparation method for iron-based alloy powder EBSD test sample17 Jun 2025US 12,332,155 B2Central South University
- Metal resin composite, preparation method thereof, and electronic product housing having the same4 Feb 2025US 12,215,424 B2BYD Company Limited
- Copper metallization for through-glass vias on thin glass14 Jan 2025US 12,200,875 B2Industrial Technology Research Institute
- Aluminum matrix composite material and preparation method therefor, and electronic device2 Jul 2026US 2026/0185258 A1Huawei Technologies Co., Ltd.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
- Composition for depositing a palladium coating on a substrate30 Oct 2025US 2025/0333847 A1Atotech Deutschland GmbH
- Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor Devices13 Feb 2025US 2025/0051927 A1
- Device for Printing to a Recording Medium30 Jan 2025US 2025/0034716 A1Canon Production Printing Holding B. V.
Most cited
By later US patents
- Method for forming Co-W-P-Au films259US 6,323,128 B1International Business Machines Corporation · 2001
- Method for electroless nickel plating of metal substrates251US 5,843,538 A1998
- Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication240US 6,261,637 B1Enthone-OMI, Inc. · 2001
- Method for preparing a conductive pad for electrical connection and conductive pad formed81US 6,335,104 B12002
- Chemical plating process56US 4,002,778 AE. I. Du Pont de Nemours and Company · 1977