C23C 18/1844
With use of organic or inorganic compounds other than metals, first
Official title: {with use of organic or inorganic compounds other than metals, first}
C23C18/1844 (With use of organic or inorganic compounds other than metals, first) appears on 154 US grants and 232 published applications in this corpus.
Search patents in C23C- Granted patents
- 154
- Published applications
- 232
- Assignees
- 145
- Inventors
- 627
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 3 |
| 2002 | 2 | 2 |
| 2003 | 4 | 4 |
| 2004 | 4 | 9 |
| 2005 | 1 | 11 |
| 2006 | 3 | 10 |
| 2007 | 6 | 10 |
| 2008 | 2 | 8 |
| 2009 | 0 | 13 |
| 2010 | 3 | 13 |
| 2011 | 1 | 7 |
| 2012 | 6 | 6 |
| 2013 | 6 | 11 |
| 2014 | 3 | 8 |
| 2015 | 9 | 18 |
| 2016 | 13 | 13 |
| 2017 | 8 | 20 |
| 2018 | 10 | 7 |
| 2019 | 7 | 5 |
| 2020 | 9 | 19 |
| 2021 | 6 | 8 |
| 2022 | 6 | 12 |
| 2023 | 4 | 7 |
| 2024 | 3 | 5 |
| 2025 | 3 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low friction coating for melt blown die and preparation method for coating31 Mar 2026US 12,590,037 B2Taizhou Clean Carbon Technology Co., Ltd.
- Preparation method for iron-based alloy powder EBSD test sample17 Jun 2025US 12,332,155 B2Central South University
- Metal resin composite, preparation method thereof, and electronic product housing having the same4 Feb 2025US 12,215,424 B2BYD Company Limited
- Copper metallization for through-glass vias on thin glass14 Jan 2025US 12,200,875 B2Industrial Technology Research Institute
- Electroless plating of objects with carbon-based material25 Jun 2024US 12,018,377 B2Graphene Leaders Canada Inc.
- Aluminum matrix composite material and preparation method therefor, and electronic device2 Jul 2026US 2026/0185258 A1Huawei Technologies Co., Ltd.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
- Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor Devices13 Feb 2025US 2025/0051927 A1
- Wire and method for manufacturing wire17 Oct 2024US 2024/0344202 A1Sumitomo Electric Industries, Ltd.
- Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing method for laminate1 Aug 2024US 2024/0260200 A1Ymt Co., Ltd.
Most cited
By later US patents
- Method for electroless nickel plating of metal substrates251US 5,843,538 A1998
- Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication240US 6,261,637 B1Enthone-OMI, Inc. · 2001
- Method for preparing a conductive pad for electrical connection and conductive pad formed81US 6,335,104 B12002
- Chemical plating process56US 4,002,778 AE. I. Du Pont de Nemours and Company · 1977
- Process for the preparation of precious metal-coated particles40US 4,450,188 A1984