Method for electroless nickel plating of metal substrates
AssigneeJohn L. Raymond
InventorsRobert Ehrsam, John L. Raymond
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Abstract
The present invention relates to a method for plating nickel onto metal substrates. The method broadly comprises the steps of passing the metal substrate to be plated through a dilute organic acid bath solution to remove contaminants and other deleterious materials, agitating the bath solution as the metal substrate passes therethrough, and thereafter electrolessly plating nickel on the surfaces of the metal substrate. The method of the present invention may be used to nickel plate substrates formed from steel, copper and aluminum.
Claims14
A method for providing a nickel coating on a substrate, the method comprising the steps of:
- providing a substrate formed from a material selected from the group consisting of metals and metal alloys;
- providing an organic acid solution comprising an organic acid, a surfactant and water, wherein the surfactant is selected from the group consisting of non-ionic fluorocarbon surfactants and anionic fluorocarbon surfactants;
- agitating the organic acid solution to provide an agitated organic acid solution;
- immersing the substrate in the agitated organic acid solution;
- providing an electroless plating solution containing nickel;
- and
- immersing the substrate in the electroless plating solution so as to deposit nickel on the substrate.
A method for providing a metallic coating on a substrate, the method comprising the steps of:
- providing a substrate formed from a material selected from the group consisting of metals and metal alloys;
- providing an alkaline cleaner solution;
- immersing the substrate in the alkaline cleaner solution;
- providing an organic acid bath solution comprising an organic acid, a surfactant and water, wherein the surfactant is selected from the group consisting of non-ionic fluorocarbon surfactants and anionic fluorocarbon surfactants;
- agitating the organic acid bath solution to provide an agitated organic acid bath solution;
- immersing the substrate in the agitated organic acid bath solution;
- providing a palladium solution comprising palladium, acid and water;
- immersing the substrate in the palladium solution;
- providing an electroless plating solution containing nickel;
- and
- immersing the substrate in the electroless plating solution so as to deposit nickel on the substrate.
Dependencies are inferred from the claim text.