C23C 18/1841
With use of metal first
Official title: {with use of metal first}
C23C18/1841 (With use of metal first) appears on 34 US grants and 57 published applications in this corpus.
Search patents in C23C- Granted patents
- 34
- Published applications
- 57
- Assignees
- 53
- Inventors
- 149
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 0 | 3 |
| 2005 | 2 | 4 |
| 2006 | 2 | 2 |
| 2007 | 1 | 4 |
| 2008 | 1 | 4 |
| 2009 | 1 | 2 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 3 |
| 2013 | 0 | 3 |
| 2014 | 1 | 0 |
| 2015 | 3 | 3 |
| 2016 | 3 | 5 |
| 2017 | 2 | 7 |
| 2018 | 4 | 3 |
| 2019 | 0 | 3 |
| 2020 | 1 | 3 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 1 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Multilayer corrosion system9 Sep 2025US 12,410,525 B2MacDermid, Incorporated
- Composite copper foil10 Oct 2023US 11,781,236 B2Namics Corporation
- Plating method, plating apparatus and recording medium25 Jan 2022US 11,230,767 B2Tokyo Electron Limited
- Anti-multipactor device28 Jul 2020US 10,724,141 B2Consejo Superior De Investigaciones Cientificas (Csic)
- Patterning of electroless metals by selective deactivation of catalysts24 Jul 2018US 10,034,386 B2Averatek Corporation
- Device for Printing to a Recording Medium30 Jan 2025US 2025/0034716 A1Canon Production Printing Holding B. V.
- Multilayer corrosion system2 Nov 2023US 2023/0349049 A1MacDermid, Incorporated
- Metal displacement solution, method for surface treatment of aluminum or aluminum alloy18 May 2023US 2023/0151493 A1C. Uyemura & Co., Ltd.
- Solution and process for the activation of nonconductive area for electroless process25 Aug 2022US 2022/0267906 A1Jetchem International Co., Ltd.
- Composite copper foil22 Oct 2020US 2020/0332431 A1Namics Corporation
Most cited
By later US patents
- Method for forming Co-W-P-Au films259US 6,323,128 B1International Business Machines Corporation · 2001
- Sensitized substrates for chemical metallization32US 3,962,494 APhotocircuits Division of Kollmorgan Corporation · 1976
- Method for rendering non-platable surfaces platable30US 4,181,760 ASurface Technology, Inc. · 1980
- Durable electrode coatings21US 5,882,723 AThe Dow Chemical Company · 1999
- Method for forming Co-W-P-Au films21US 6,646,345 B2International Business Machines Corporation · 2003