Back to results
US 2022/0267906 A1Published application
Solution and process for the activation of nonconductive area for electroless process
AssigneeJetchem International Co., Ltd.
InventorChia-Chen CHANG
Life of this patent
Estimating the term…
Abstract
The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin and surfactants. Activators of the invention are preferably employed for electroless copper deposition.
Claims13
A method for depositing an electroless plating activator on a substrate, comprising:
- (a) providing a substrate;
- (b) applying an activator composition to the substrate;
- (c) applying a reducing agent to the substrate;
- wherein the activator composition comprising at least one metal ion and at least one organic acid;
- wherein the organic acid has at least one carboxylic group and at least one hydroxyl group.
2 more elements
Dependencies are inferred from the claim text.