Composite copper foil
AssigneeNamics Corporation
InventorsMakiko Sato, Osamu Suzuki, Naoki Obata, Yoshinobu Kokaji
Life of this patent
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Abstract
[Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.
Claims10
A composite copper foil comprising a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein
- at least a part of the composite copper foil has protrusions on a surface thereof,
- each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil,
- the metal layer is formed on at least a part of a surface of the protrusions of the copper foil,
- a number of protrusions with a height of 50 nm or more is, on average, 15 or more and 100 or less per a 3.8-μm range of a cross-section of the composite copper foil, and
- arithmetic average roughness (Ra) of the protrusions is 0.02 μm or more and 0.20 μm or less.
Dependencies are inferred from the claim text.