Plating method, plating apparatus and recording medium
AssigneeTokyo Electron Limited
InventorsYuichiro Inatomi, Takashi Tanaka, Kazutoshi Iwai
Life of this patent
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Abstract
A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.
Claims4
A plating method, comprising:
- preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface of the substrate;
- imparting a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate;
- and
- forming a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate in a state that the plateable material portion and the non-plateable material portion are exposed at the surface of the substrate,
- wherein the plating liquid contains an inhibitor which suppresses the plating layer from being precipitated on the non-plateable material portion,
- the catalyst imparting processing is performed by supplying, onto the substrate, a catalyst solution containing a metal catalyst in a form of nanoparticles and a polyvinylpyrrolidone (PVP) as a dispersant for dispersing the metal catalyst in the catalyst solution, and
- the non-plateable material portion is made of a material containing SiO2 as a main component.
Dependencies are inferred from the claim text.