Pretreating solution for electroless plating, electroless plating bath and electroless plating process

A pretreating solution for electroless plating comprising an alkali, a reducing agent, a complexing agent and a solvent dissolving the alkali, the reducing agent, and the complexing agent, and wherein the pretreating solution is copper ion free.

An electroless plating system comprising:

• a pretreating solution comprising an alkali solution, a reducing agent and a complexing agent, and wherein the pretreating solution is copper ion free;
• and
• an electroless copper plating solution comprising a pH adjusting agent, a reducing agent, copper ions and trialkanol amine.

An electroless plating system comprising:

• a pretreating solution comprising an alkali, a reducing agent, a complexing agent and a solvent dissolving the alkali, the reducing agent, and the complexing agent, and wherein the pretreating solution is copper ion free;
• and
• an electroless copper plating solution comprising a pH adjusting agent, a reducing agent, copper ions and trialkanol amine.

An electroless plating bath comprising:

• a tank of a pretreating solution for electroless plating comprising a alkali solution, a reducing agent, and a complexing agent, wherein the pretreating solution is copper ion free;
• and
• a tank of an electroless plating solution comprising a pH adjusting agent, a reducing agent, a metal ion, and a complexing agent.

An electroless plating bath comprising:

• a tank of a pretreating solution for electroless plating comprising an alkali, a reducing agent, a complexing agent, and a solvent dissolving the alkali, the reducing agent, and the complexing agent, wherein the pretreating solution is copper ion free;
• and
• a tank of an electroless plating solution comprising a pH adjusting agent, a reducing agent, a metal ion, and a complexing agent.

A pretreating solution for electroless plating consisting essentially of an alkali solution, a reducing agent and a complexing agent.

A pretreating solution for electroless plating consisting essentially of an alkali, a reducing agent, a complexing agent and a solvent dissolving the alkali, the reducing agent, and the complexing agent.

An electroless plating system comprising:

• a pretreating solution consisting essentially of an alkali solution, a reducing agent and a complexing agent;
• and
• an electroless copper plating solution comprising a pH adjusting agent, a reducing agent, copper ions and trialkanol amine.

An electroless plating system comprising:

• a pretreating solution consisting essentially of an alkali, a reducing agent, a complexing agent and a solvent dissolving the alkali, the reducing agent, and the complexing agent;
• and
• an electroless copper plating solution comprising a pH adjusting agent, a reducing agent, copper ions and trialkanol amine.

An electroless plating bath comprising:

• a tank of a pretreating solution for electroless plating consisting essentially of an alkali solution, a reducing agent and a complexing agent;
• and
• a tank of an electroless plating solution comprising a pH adjusting agent, a reducing agent, a metal ion and a complexing agent.

An electroless plating bath comprising:

• a tank of a pretreating solution for electroless plating consisting essentially of an alkali, a reducing agent, a complexing agent and a solvent dissolving the alkali, the reducing agent, and the complexing agent;
• and
• a tank of an electroless plating solution comprising a pH adjusting agent, a reducing agent, a metal ion and a complexing agent.