Method for depositing a metal on a surface
AssigneeKollmorgen Technologies Corporation
InventorsYu-Ling Teng, Richard Mayernik
Life of this patent
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Abstract
An improved method for making conductive metal patterns involving the steps of treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing compound, exposing said substrate to light radiant energy, fixing with a solution comprised of a complexing agent followed by electroless deposition, the improvement comprising extending the bath life of said fixing solution by maintaining the concentration of the light sensitive reducing compound on the fixing solution so that it does not exceed 0.4 m moles/liter.
Claims19
In a method for making conductive metal patterns by treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing compound selected from quinones, benzoquinones, anthraquinones and derivatives thereof, and anthraquinone disulfonic acids and salts thereof;
- exposing the treated substrate to light radiant energy to reduce the metal salt to form a real image;
- and
- immersing the substrate in an electroless metal deposition bath to deposit a conductive metal pattern on the real image;
- the improvement comprising treating the exposed substrate, prior to electrolessly depositing metal in a fixed bath with a fixing solution comprising a complexing agent for the non-noble metal wherein as a result of said treatment, light sensitive reducing compound builds up in the bath;
- said fixing solution being maintained so that the concentration of the light sensitive reducing compound in the fixing solution does not exceed 0.4 m moles/liter.
In a method for making conductive metal patterns by treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing agent selected from quinones, benzoquinones, anthraquinones and derivatives thereof, and anthraquinone disulfonic acids and salts thereof;
- exposing the treated substrate to light radiant energy to reduce the metal salt to form a real image;
- and
- immersing the substrate in an electroless metal deposition bath to deposit a conductive metal pattern on the real image;
- the improvement comprising treating the exposed substrate, prior to electrolessly depositing metal in a fixed bath with a fixing solution comprising a complexing agent for the non-noble metal and a reducing agent, wherein as a result of said treatment, light sensitive reducing compound builds up in the bath;
- said fixing solution being maintained so that the concentration of the light sensitive reducing compound in the fixing solution does not exceed 0.4 m moles/liter.
Dependencies are inferred from the claim text.