C23C 16/515
Using pulsed discharges
Official title: using pulsed discharges
C23C16/515 (Using pulsed discharges) appears on 308 US grants and 390 published applications in this corpus.
Search patents in C23C- Granted patents
- 308
- Published applications
- 390
- Assignees
- 187
- Inventors
- 872
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 11 | 0 |
| 2001 | 2 | 3 |
| 2002 | 4 | 22 |
| 2003 | 13 | 10 |
| 2004 | 6 | 27 |
| 2005 | 6 | 15 |
| 2006 | 10 | 20 |
| 2007 | 7 | 13 |
| 2008 | 10 | 15 |
| 2009 | 10 | 17 |
| 2010 | 13 | 12 |
| 2011 | 12 | 13 |
| 2012 | 7 | 14 |
| 2013 | 16 | 9 |
| 2014 | 11 | 13 |
| 2015 | 8 | 16 |
| 2016 | 6 | 10 |
| 2017 | 10 | 14 |
| 2018 | 8 | 13 |
| 2019 | 11 | 21 |
| 2020 | 7 | 21 |
| 2021 | 16 | 14 |
| 2022 | 10 | 21 |
| 2023 | 15 | 20 |
| 2024 | 12 | 13 |
| 2025 | 14 | 15 |
| 2026 | 11 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Deposition methods using pulsed plasma with varying pulse frequency25 Aug 2026US 12,716,131 B2Tokyo Electron Limited
- Plasma processing apparatus25 Aug 2026US 12,719,027 B2Tokyo Electron Limited
- Hydrophobic and oleophobic coating, preparation method therefor, and product11 Aug 2026US 12,703,942 B2Jiangsu Favored Nanotechnology Co., Ltd.
- Methods for depositing phosphorus-doped silicon nitride films5 May 2026US 12,618,147 B2APPLIED Materials.Inc.
- Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated7 Apr 2026US 12,595,550 B2Evatec AG
- Metal deposition using pulsed voltage27 Aug 2026US 2026/0253848 A1APPLIED Materials.Inc.
- Topology-selective deposition method and structure formed using same20 Aug 2026US 2026/0242945 A1ASM IP Holding B. V.
- Processing tool capable for forming carbon layers on substrates23 Jul 2026US 2026/0215180 A1Lam Research Corporation
- Dual frequency pulsed plasma processing treatments18 Jun 2026US 2026/0171360 A1APPLIED Materials.Inc.
- Deposition methods using pulsed plasma with varying pulse frequency28 May 2026US 2026/0146322 A1Tokyo Electron Limited
Most cited
By later US patents
- Plasma enhanced pulsed layer deposition613US 6,689,220 B1Simplus Systems Corporation · 2004
- Method of forming conformal film having si-N bonds on high-aspect ratio pattern597US 8,394,466 B2ASM Japan K .K. · 2013
- Pulsed dual radio frequency CVD process568US 4,837,185 AIntel Corporation · 1989
- Pulsed PECVD method for modulating hydrogen content in hard mask545US 7,381,644 B1Novellus Systems, Inc. · 2008
- Method for improving process control and film conformality of PECVD film540US 7,745,346 B2Novellus Systems, Inc. · 2010