C23C 14/568
Transferring the substrates through a series of coating stations
Official title: {Transferring the substrates through a series of coating stations (C23C14/562 takes precedence)}
C23C14/568 (Transferring the substrates through a series of coating stations) appears on 799 US grants and 980 published applications in this corpus.
Search patents in C23C- Granted patents
- 799
- Published applications
- 980
- Assignees
- 389
- Inventors
- 2,199
- Latest grant
- 25 Aug 2026
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| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
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| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 11 | 0 |
| 1995 | 11 | 0 |
| 1996 | 11 | 0 |
| 1997 | 26 | 0 |
| 1998 | 14 | 0 |
| 1999 | 23 | 0 |
| 2000 | 28 | 0 |
| 2001 | 39 | 18 |
| 2002 | 25 | 33 |
| 2003 | 23 | 36 |
| 2004 | 19 | 33 |
| 2005 | 18 | 40 |
| 2006 | 5 | 36 |
| 2007 | 10 | 37 |
| 2008 | 17 | 38 |
| 2009 | 21 | 43 |
| 2010 | 20 | 45 |
| 2011 | 19 | 48 |
| 2012 | 36 | 45 |
| 2013 | 29 | 38 |
| 2014 | 22 | 43 |
| 2015 | 38 | 30 |
| 2016 | 30 | 37 |
| 2017 | 23 | 54 |
| 2018 | 29 | 41 |
| 2019 | 20 | 35 |
| 2020 | 40 | 38 |
| 2021 | 15 | 30 |
| 2022 | 21 | 55 |
| 2023 | 25 | 44 |
| 2024 | 30 | 41 |
| 2025 | 30 | 28 |
| 2026 | 9 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Low pressure vapor phase deposition of organic thin films1,502US 6,337,102 B12002
- Modular wafer transport and processing system655US 4,917,556 AVarian Associates, Inc. · 1990
- Process chamber sleeve with ring seals for isolating individual process modules in a common cluster571US 5,667,592 AGaSonics International · 1997
- Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus433US 5,310,410 ASputtered Films, Inc. · 1994
- Apparatus for forming a thin film on surface of semiconductor substrate417US 5,174,881 AMitsubishi Denki Kabushiki Kaisha · 1992