C22C 13/02
Alloys based on tin: with antimony or bismuth as the next major
Official title: with antimony or bismuth as the next major constituent
C22C13/02 (Alloys based on tin: with antimony or bismuth as the next major) appears on 251 US grants and 350 published applications in this corpus.
Search patents in C22C- Granted patents
- 251
- Published applications
- 350
- Assignees
- 162
- Inventors
- 665
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 1 |
| 2002 | 3 | 7 |
| 2003 | 4 | 4 |
| 2004 | 0 | 8 |
| 2005 | 3 | 1 |
| 2006 | 4 | 6 |
| 2007 | 2 | 10 |
| 2008 | 1 | 8 |
| 2009 | 3 | 9 |
| 2010 | 4 | 5 |
| 2011 | 5 | 8 |
| 2012 | 5 | 6 |
| 2013 | 6 | 8 |
| 2014 | 5 | 15 |
| 2015 | 8 | 19 |
| 2016 | 11 | 30 |
| 2017 | 14 | 19 |
| 2018 | 8 | 20 |
| 2019 | 24 | 26 |
| 2020 | 10 | 18 |
| 2021 | 15 | 24 |
| 2022 | 15 | 35 |
| 2023 | 26 | 16 |
| 2024 | 21 | 18 |
| 2025 | 11 | 19 |
| 2026 | 10 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint26 May 2026US 12,636,738 B2Senju Metal Industry Co., Ltd.
- Solder material for semiconductor device12 May 2026US 12,624,418 B2Fuji Electric Co., Ltd.
- Metal particle for joint material28 Apr 2026US 12,611,737 B2TDK Corporation
- Sn-based alloy solder pastes21 Apr 2026US 12,606,887 B2Heraeus Electronics GmbH & Co. KG
- Solder alloy, solder ball and solder joint24 Mar 2026US 12,583,060 B2Senju Metal Industry Co., Ltd.
- Substrate for mounting, connecting structure, and electronic component20 Aug 2026US 2026/0247777 A1Taiyo Holdings Co., Ltd.
- Solder Alloy, Solder Paste, Solder Ball, and Solder Joint25 Jun 2026US 2026/0175332 A1Senju Metal Industry Co., Ltd.
- Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder Joint25 Jun 2026US 2026/0175333 A1Senju Metal Industry Co., Ltd.
- Solder Alloy, Solder Ball, Solder Paste, and Solder Joint30 Apr 2026US 2026/0115840 A1Senju Metal Industry Co., Ltd.
- Flux and solder paste23 Apr 2026US 2026/0108989 A1Senju Metal Industry Co., Ltd.
Most cited
By later US patents
- Degradable compositions, apparatus comprising same, and method of use106US 8,211,247 B2Schlumberger Technology Corporation · 2012
- Flip-Chip interconnections using lead-free solders99US 6,224,690 B1International Business Machines Corporation · 2001
- Tin base lead-free solder composition containing bismuth, silver and antimony73US 4,806,309 AWillard Industries, Inc. · 1989
- Pb-free, tin base solder composition64US 4,758,407 AJ.W. Harris Co., Inc. · 1988
- Solder alloy, solder paste, and electronic circuit board59US 9,221,132 B2Harima Chemicals, Inc. · 2015