Substrate for mounting, connecting structure, and electronic component

Abstract

[Problem] Provided is a substrate for mounting, precluding poor connection caused by positional deviation even in the case of mounting a minute on-board component. [Solution] The substrate for mounting according to the present invention is a substrate for mounting an on-board component. The substrate for mounting comprises a circuit board on which a plurality of electrodes are placed at a predetermined spacing, and a resin layer including a plurality of openings in the upper regions of the electrodes of the circuit board. In the substrate, in a case in which each opening of the resin layer has a size of X μm in a longitudinal direction and Y μm in a lateral direction, and the on-board component has a size of x μm in a longitudinal direction and y μm in a lateral direction, the following conditions: x+20<X<2x and y +20<Y<√(x2+y2) are satisfied.

Dependencies are inferred from the claim text.