Flux and solder paste
AssigneeSenju Metal Industry Co., Ltd.
InventorsRyuji UKAI, Tomoko TAKAGI, Haruya SAKUMA, Hisahiko YOSHIDA, Shunsuke KOGA, Naomasa OKA, Jotaro MORI
Life of this patent
Estimating the term…
Loading patent…
AssigneeSenju Metal Industry Co., Ltd.
InventorsRyuji UKAI, Tomoko TAKAGI, Haruya SAKUMA, Hisahiko YOSHIDA, Shunsuke KOGA, Naomasa OKA, Jotaro MORI
Estimating the term…
A flux according to the present invention contains rosin, a polymer (P) having a repeating unit represented by General Formula (p1), a solvent, a thixotropic agent containing polyamide, a specific dicarboxylic acid, and a specific compound having a benzotriazole skeleton. In General Formula (p1), R1 represents a methyl group or a hydrogen atom. R2 represents a hydrocarbon group having 1 or 2 carbon atoms or a hydrogen atom. According to such a flux, the cohesiveness of the solder alloy powder is high during reflow, the blackening of flux residue is suppressed, and the precipitation with time is unlikely to occur, and the favorable temporal stability can be provided.
A flux comprising:
Dependencies are inferred from the claim text.