Pb-free, tin base solder composition
AssigneeJ.W. Harris Co., Inc.
InventorsRichard E. Ballentine, Joseph W. Harris
Life of this patent
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Abstract
A lead free, cadmium free tin and tin/antimony based solder alloy having a wide melting range for joining copper tubes and brass pipe and fittings. The non-toxic tin based solder composition has a range of 92.5-96.9% tin, 3.0-5.0% copper, 0.1-2.0% nickel and 0.0-5.0% silver. The non-toxic tin/antimony based solder composition has a range of 87.0-92.9% tin, 4.0-6.0% antimony, 3.0-5.0% copper, 0.0-2.0% nickel and 0.0-0.5% silver and is especially suited for plumbing applications having tight loose fitting solder joints which are exposed to potable water.
Claims11
A lead-free metal solder composition comprising, by weight:
- 0.1-2.0% nickel
- 3.0-5.0% copper
- 4.0-6.0% antimony
- 87.0-92.9% tin
A lead-free metal solder composition comprising, by weight:
- 0.1-0.5% silver
- 0.1-2.0% nickel
- 3.0-5.0% copper
- 4.0-6.0% antimony
- 87.0-92.9% tin
A lead-free metal solder composition comprising, by weight:
- 0.1-0.5% silver
- 3.0-5.0% copper
- 4.0-6.0% antimony
- 87.0-92.9% tin
A lead-free metal solder composition comprising, by weight:
- 0.1-2.0% nickel
- 3.0-5.0% copper
- 93.0-96.9% tin
A lead-free metal solder composition comprising by weight:
- 0.1-0.5% silver
- 0.1-2.0% nickel
- 3.0-5.0% copper
- 92.5%-96.8% tin
Dependencies are inferred from the claim text.