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US 12,606,887 B2Granted
Sn-based alloy solder pastes
AssigneeHeraeus Electronics GmbH & Co. KG
InventorsPeter Prenosil, Sebastian Fritzsche, Katja Stenger
Life of this patent
Estimating the term…
Abstract
Alloy comprising 90 to 96.8 wt. % of tin; 0.1 to 2.0 wt. % of silver; 2.0 to 4.0 wt. % of bismuth; 1.0 to 2.0 wt. % of antimony; 0.1 to 1.0 wt. % of copper; and 0.01 to 1 wt. % of germanium.
Claims12
A solder paste comprising:
- 82 to 92 wt. % of an alloy consisting essentially of:
- 90 to 96.8 wt. % of tin;
- 0.1 to 2.0 wt. % of silver;
- 2.0 to 4.0 wt. % of bismuth;
- 1.0 to 2.0 wt. % of antimony;
- 0.1 to 1.0 wt. % of copper;
- and
- 0.01 to 1 wt. % of germanium;
- and
- 8 to 18 wt. % of a flux.
7 more elements
Dependencies are inferred from the claim text.