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US 2026/0115840 A1Published application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
AssigneeSenju Metal Industry Co., Ltd.
InventorsTakahiro Yokoyama, Shunsaku Yoshikawa, Shigeto Suzuki
Life of this patent
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Abstract
Provided are a solder alloy, a solder ball, a solder paste, and a solder joint, which have an excellent in thermal conductivity, drop impact resistance, and heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 4.0%, Cu: 0.10 to 1.00%, Sb: 1.0 to 7.0%, Co: 0.001 to 0.030%, Fe: 0.005 to 0.050%, with the balance being Sn.
Claims15
A solder alloy having an alloy composition consisting of, by mass %, Ag:
- 1.0 to 4.0%, Cu:
- 0.10 to 1.00%, Sb:
- 1.0 to 7.0%, Co:
- 0.001 to 0.030%, Fe:
- 0.005 to 0.050%, with the balance being Sn.
2 more elements
Dependencies are inferred from the claim text.