Back to results
US 4,806,309 AGranted
Tin base lead-free solder composition containing bismuth, silver and antimony
AssigneeWillard Industries, Inc.
InventorStanley Tulman
Life of this patent
Estimating the term…
Abstract
A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver.
Claims3
A lead-free solder composition consisting essentially of tin, antimony, bismuth and silver, wherein the percentage weight proportions are:
- Tin--Approximately 90-95%,
- Antimony--Approximately 3-5%,
- Bismuth--Appoximately 1-4.5%,
- Silver--Approximately 0.1-0.5%.
1 more element
Dependencies are inferred from the claim text.