Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder Joint

Abstract

Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint which have excellent drop impact resistance and heat cycle resistance, can suppress the occurrence of chip standing, bridges and icicles, and can also suppress the occurrence of electromigration. The solder alloy has an alloy composition of, by mass %, Ag: 0.3 to 1.9%, Cu: 0.40 to 1.00%, Bi: 0.5 to 4.9%, P: 0.00100 to 0.02000%, with the balance being Sn. The alloy composition may further contain, by mass %, each of Ge, Co and Ga in an amount of 0.06% or less, and at least one. In addition, the alloy composition may further contain, by mass %, each of As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr and Pt in an amount of 0.06% or less, and containing at least one of them.

Dependencies are inferred from the claim text.