Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
AssigneeSenju Metal Industry Co., Ltd.
InventorsTakahiro Yokoyama, Kanta Dei, Takahiro Matsufuji, Hikaru Nomura, Shunsaku Yoshikawa
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Abstract
A solder alloy includes an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder paste includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder ball includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn.
Claims16
A solder alloy consisting of 54 to 68 mass % of Bi, 1.2 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, optionally at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less, optionally at least one of P, Ge, and Ga in total amount of 0.1 mass % or less, and a balance of Sn, wherein a Bi phase in the solder alloy is finer than a Sn phase in the solder alloy such that the solder alloy leads to excellent ductility and heat-cycle resistance compared to a solder alloy lacking In and Pd.
Dependencies are inferred from the claim text.