C22C 13/00
Alloys based on tin
C22C13/00 (Alloys based on tin) appears on 793 US grants and 1,060 published applications in this corpus.
Search patents in C22C- Granted patents
- 793
- Published applications
- 1,060
- Assignees
- 451
- Inventors
- 2,041
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 14 | 5 |
| 2002 | 9 | 20 |
| 2003 | 14 | 21 |
| 2004 | 8 | 27 |
| 2005 | 10 | 17 |
| 2006 | 13 | 34 |
| 2007 | 17 | 43 |
| 2008 | 5 | 28 |
| 2009 | 13 | 37 |
| 2010 | 20 | 36 |
| 2011 | 19 | 33 |
| 2012 | 15 | 34 |
| 2013 | 28 | 38 |
| 2014 | 26 | 53 |
| 2015 | 31 | 66 |
| 2016 | 43 | 77 |
| 2017 | 46 | 67 |
| 2018 | 48 | 52 |
| 2019 | 63 | 61 |
| 2020 | 44 | 64 |
| 2021 | 42 | 58 |
| 2022 | 39 | 58 |
| 2023 | 51 | 42 |
| 2024 | 45 | 42 |
| 2025 | 33 | 32 |
| 2026 | 19 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device including semiconductor element and lead-free solder bonding material and method for manufacturing the same25 Aug 2026US 12,721,207 B2Hitachi Power Semiconductor Device, Ltd.
- Passive quench protection techniques for non-insulated superconducting magnets4 Aug 2026US 12,700,530 B2Commonwealth Fusion Systems LLC
- Silver-tin coating for electrical connectors, and electrical connectors with siliver-tin coatings28 Jul 2026US 12,695,229 B2Wieland Rolled Products North America, LLC
- Lithium ion battery negative electrode active material16 Jun 2026US 12,658,429 B2Daido Steel Co., Ltd.
- Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint26 May 2026US 12,636,738 B2Senju Metal Industry Co., Ltd.
- Flux, solder paste, and method for producing joined structure3 Sep 2026US 2026/0257305 A1Koki Company Limited
- Substrate for mounting, connecting structure, and electronic component20 Aug 2026US 2026/0247777 A1Taiyo Holdings Co., Ltd.
- Solder Alloy, Solder Paste, Solder Ball, and Solder Joint25 Jun 2026US 2026/0175332 A1Senju Metal Industry Co., Ltd.
- Solder Alloy, Solder Paste, Solder Ball, Solder Preform, and Solder Joint25 Jun 2026US 2026/0175333 A1Senju Metal Industry Co., Ltd.
- Metal filaments for fused filament fabrication21 May 2026US 2026/0138183 A1Stacked Circuits Printing Materials LLC
Most cited
By later US patents
- Degradable compositions, apparatus comprising same, and method of use106US 8,211,247 B2Schlumberger Technology Corporation · 2012
- Flip-Chip interconnections using lead-free solders99US 6,224,690 B1International Business Machines Corporation · 2001
- Ultrasonic object consolidation76US 6,519,500 B1Solidica, Inc. · 2003
- Tin base lead-free solder composition containing bismuth, silver and antimony73US 4,806,309 AWillard Industries, Inc. · 1989
- Pb-free, tin base solder composition64US 4,758,407 AJ.W. Harris Co., Inc. · 1988