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US 2026/0138183 A1Published application
Metal filaments for fused filament fabrication
AssigneeStacked Circuits Printing Materials LLC
InventorBrian Anthony Minnick
Life of this patent
Estimating the term…
Abstract
Disclosed herein are metal filaments. Also disclosed are methods of making and using said metal filaments.
Claims30
A metal filament comprising a plurality of metal particles embedded within a metal matrix, wherein:
- the metal matrix comprises:
- about 30% to about 99.9% tin (w/w);
- about 0% to about 70% bismuth (w/w);
- about 0% to about 5% silver (w/w);
- and
- about 0% to about 5% copper;
- and
- the metal particles comprise:
- about 0% to about 99% tin (w/w);
- about 0% to about 5% silver (w/w);
- and
- about 0.1% to about 100% copper (w/w).
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Dependencies are inferred from the claim text.